DownStream Technologies

Solutions for Post Processing PCB Designs

Analysis Checklist

  • Track to Track - Minimum distance between adjacent traces
  • Track to Pad – Minimum distance between a trace and pad.
  • Pad to Pad – Minimum distance between adjacent pads.
  • Track to Copper – Minimum distance between a trace and any copper (traces, plane areas, etc).
  • Copper to Pad – Minimum distance between a pad and adjacent copper (traces, plane areas, etc).
  • Copper to Board – Minimum distance between copper and the board outline.
  • Copper to Mill Path – Minimum distance between copper and adjacent mill paths.
  • Copper to Mill Tab – Minimum distance between copper and adjacent mill tabs.
  • Copper to Copper – Minimum distance between copper and adjacent copper (traces, plane areas, etc).
  • Pin Pad to Pin Pad – Minimum distance between adjacent pins of a part.
  • SMD to SMD – Minimum distance between adjacent SMD pads.
  • Via to Via – Minimum distance between adjacent through vias.
  • Laser Via to Laser Via – Minimum distance between adjacent laser vias.
  • Through to Through – Minimum distance between adjacent pads with through drills.
  • SMD to Via – Minimum distance between SMD pads and adjacent through vias.
  • SMD to Laser Via – Minimum distance between SMD pads and adjacent laser vias.
  • SMD to Through – Minimum distance between SMD pads and adjacent pads with through drills.
  • Via to Through – Minimum distance between through vias and adjacent pads with through drills.
  • Laser Via to Through – Minimum distance between laser vias and adjacent pads with through drills.
  • Unplated Through Drill to Copper – Minimum distance between unplated through drills and adjacent copper.
  • Unplated Through Drill to Pad – Minimum distance between unplated through drills and adjacent pads.
  • Unplated Through Drill to Track – Minimum distance between unplated through drills and adjacent traces.
  • Through Drill to Copper – Minimum distance between through drills and adjacent copper.
  • Through Drill to Pad – Minimum distance between through drills and adjacent pads.
  • Through Drill to Track – Minimum distance between through drills and adjacent traces.
  • Back Drill to Copper – Minimum distance between back drills and adjacent copper.
  • Back Drill to Pad – Minimum distance between back drills and adjacent pads.
  • Back Drill to Track – Minimum distance between back drills and adjacent traces.
  • Via Drill to Copper – Minimum distance between through via drills and adjacent copper.
  • Via Drill to Pad – Minimum distance between through via drills and adjacent pads.
  • Via Drill to Track – Minimum distance between through via drills and adjacent traces.
  • Laser Via Drill to Copper – Minimum distance between laser via drills and adjacent copper.
  • Laser Via Drill to Pad – Minimum distance between laser via drills and adjacent pads.
  • Laser Via Drill to Track – Minimum distance between laser via drills and adjacent traces.
  • Pin Pad to Drill Annular Ring – Minimum annular ring of pad around a drill in a part pin pad.
  • Pressfit Pin Pad to Drill Annular Ring – Minimum annular ring of pad around a drill in a pressfit pin pad.
  • Via to Drill Annular Ring – Minimum annular ring of pad around a drill in a through via.
  • Laser Via to Drill Annular Ring – Minimum annular ring of pad around a drill in a laser via.
  • Blind Via to Drill Annular Ring – Minimum annular ring of pad around a drill in a blind via.
  • Buried Via to Drill Annular Ring – Minimum annular ring of pad around a drill in a buried via.
  • Pad to Unplated Drill Annular Ring – Minimum annular ring of pad around an unplated drill.
  • Track to Anti-pad – Minimum Distance between a Track and an Anti-pad
  • Minimum Track – Minimum width of a trace.
  • Minimum Pad – Minimum size (diameter, width or length) of a pad.
  • Redundant Pads – Any superimposed pads.
  • Plated Drills without Pads – Any plated drill without a pad.
  • Pads without Drills – Any outer layer pad without a drill from a drill set. This includes through, blind and buried vias.
  • Antennas – Any hanging trace that does not start or terminate on a pad, via or trace junction.
  • Minimum Gap – Minimum distance between copper areas, including same polygon and copper voids.
  • Minimum Width – Minimum width for all copper, including traces and copper polygons.
  • Acid Traps – Any copper shape (traces, plane areas, etc) at acute angles that could potentially become an acid trap.
  • Copper Slivers – Any narrow sliver sized copper polygon.
  • Partial Vias in Pad – Presence of a buried via located on a pad.
  • Through Vias in Pad – Presence of a through via located on a pad.

 

  • Copper to Board – Minimum distance between copper and the board outline.
  • Copper to Mill Path – Minimum distance between copper and adjacent mill paths.
  • Copper to Mill Tab – Minimum distance between copper and adjacent mill tabs.
  • Unplated Through Drill to Copper – Minimum distance between unplated through drills and adjacent copper.
  • Unplated Through Drill to Pad – Minimum distance between unplated through drills and adjacent pads.
  • Unplated Through Drill to Track – Minimum distance between unplated through drills and adjacent traces.
  • Through Drill to Copper – Minimum distance between through drills and adjacent copper.
  • Through Drill to Pad – Minimum distance between through drills and adjacent pads.
  • Through Drill to Track – Minimum distance between through drills and adjacent traces.
  • Back Drill to Copper – Minimum distance between back drills and adjacent copper.
  • Back Drill to Pad – Minimum distance between back drills and adjacent pads.
  • Back Drill to Track – Minimum distance between back drills and adjacent traces.
  • Via Drill to Copper – Minimum distance between through via drills and adjacent copper.
  • Via Drill to Pad – Minimum distance between through via drills and adjacent pads.
  • Via Drill to Track – Minimum distance between through via drills and adjacent traces.
  • Laser Via Drill to Copper – Minimum distance between laser via drills and adjacent copper.
  • Laser Via Drill to Pad – Minimum distance between laser via drills and adjacent pads.
  • Laser Via Drill to Track – Minimum distance between laser via drills and adjacent traces.
  • Pin Pad to Drill Annular Ring – Minimum annular ring of pad around a drill in a part pin pad.
  • Pressfit Pin Pad to Drill Annular Ring – Minimum annular ring of pad around a drill in a pressfit pin pad.
  • Via to Drill Annular Ring – Minimum annular ring of pad around a drill in a through via.
  • Laser Via to Drill Annular Ring – Minimum annular ring of pad around a drill in a laser via.
  • Blind Via to Drill Annular Ring – Minimum annular ring of pad around a drill in a blind via.
  • Buried Via to Drill Annular Ring – Minimum annular ring of pad around a drill in a buried via.
  • Pad to Unplated Drill Annular Ring – Minimum annular ring of pad around an unplated drill.
  • Copper Slivers – Any narrow sliver sized copper polygon.
  • Pin Holes – Any miniscule void in copper polygons.
  • Acid Traps – Any copper shape (traces, plane areas, etc) at acute angles that could potentially become an acid trap.
  • Minimum Gap – Minimum distance between copper areas, including same polygon and copper voids.
  • Minimum Width – Minimum width for all copper, including traces and copper polygons.

 

  • Copper to Board – Minimum distance between copper and the board outline.
  • Copper to Mill Path – Minimum distance between copper and adjacent mill paths.
  • Copper to Mill Tab – Minimum distance between copper and adjacent mill tabs.
  • Through Drill to Copper – Minimum distance between through drills and adjacent copper.
  • Via Drill to Copper – Minimum distance between through via drills and adjacent copper.
  • Laser Via Drill to Copper – Minimum distance between laser via drills and adjacent copper.
  • Unplated Through Drill to Copper – Minimum distance between unplated through drills and adjacent copper.
  • Back Drill to Copper – Minimum distance between back drills and adjacent copper.
  • Pad to Drill Annular Ring – Minimum annular ring of pad around a drill in a part pin pad.
  • Via to Drill Annular Ring – Minimum annular ring of pad around a drill in a through via.
  • Laser Via to Drill Annular Ring – Minimum annular ring of pad around a drill in a laser via.
  • Blind Via to Drill Annular Ring – Minimum annular ring of pad around a drill in a blind via.
  • Buried Via to Drill Annular Ring – Minimum annular ring of pad around a drill in a buried via.
  • Anti-pad to Anti-pad – Minimum Distance between adjacent anti-pads.
  • Copper to Copper – Minimum Distance between copper.
  • Minimum Gap – Minimum distance between copper areas, including same polygon and copper voids.
  • Minimum Width – Minimum width for all copper, including traces and copper polygons.
  • Isolated Thermal – Any thermal connection to the plane constricted by adjacent data potentially isolated from the rest of the plane.
  • Starved Thermal – Any thermal connection to the plane constricted by adjacent data with minimal connection to the rest of the plane.
  • Thermal Conflict – Any pad connected to more than one plane.
  • Tie Width – Minimum width of a thermal relief spoke.

 

  • SMD to Mask Annular Ring – Minimum annular ring of solder mask exposure around an SMD pad.
  • Plated Drill Pad to Mask Annular Ring – Minimum annular ring of solder mask exposure around a Pad with a plated drill.
  • Unplated Drill Pad to Mask Annular Ring – Minimum annular ring of solder mask exposure around a Pad with an unplated drill.
  • Undrilled Pad to Mask Annular Ring – Minimum annular ring of solder mask exposure around a Pad without a drill.
  • Via to Mask Annular Ring – Minimum annular ring of solder mask exposure around a through via pad.
  • Laser Via to Mask Annular Ring – Minimum annular ring of solder mask exposure around a laser via pad.
  • Plated Through Drill to Mask Annular Ring – Minimum annular ring of solder mask exposure around a plated through drill.
  • Unplated Through Drill to Mask Annular Ring – Minimum annular ring of solder mask exposure around an unplated through drill.
  • Via drill to Mask Annular Ring – Minimum annular ring of solder mask exposure around a through via drill.
  • Laser Via drill to Mask Annular Ring – Minimum annular ring of solder mask exposure around a laser via drill.
  • Solder Mask to Track – Minimum distance between solder mask exposure and adjacent traces.
  • Solder Mask to Pad – Minimum distance between solder mask exposure and adjacent pads.
  • Solder Mask to Copper – Minimum distance between solder mask exposure and adjacent copper (traces, plane areas, etc).
  • Solder Mask Pad to Solder Mask Pad – Minimum distance between solder mask exposures for adjacent pads.
  • Solder Mask Pad to Solder Mask Area – Minimum distance between solder mask exposures for pads and adjacent solder mask areas.
  • Solder Mask Area to Solder Mask Area – Minimum distance between solder mask exposures for adjacent solder mask areas.
  • Missing Solder Mask for SMD – Any SMD pad without a solder mask exposure.
  • Missing Solder Mask for Undrilled Pad – Any pad without a drill without a solder mask exposure.
  • Missing Solder Mask for Unplated Through Drill – Any unplated through drill without a solder mask exposure.
  • Missing Solder Mask for Plated Through Drill – Any plated through drill without a solder mask exposure.
  • Missing Solder Mask for Via – Any through via without a solder mask exposure.
  • Missing Solder Mask for Laser Via – Any laser via without a solder mask exposure.
  • Missing Solder Mask for Testpoint – Any testpoint without a solder mask exposure.
  • Extra Solder Mask (Copper) – Any solder mask exposure having no copper within its boundary.
  • Extra Solder Mask (Pad) – Any solder mask exposure having no pad within its boundary.
  • Mask Slivers – Any narrow sliver sized solder mask area.
  • Solder Mask Bridge – Minimum distance between adjacent solder mask exposures.
  • Pin Holes – Any miniscule voids in solder mask areas.

 

  • Paste Mask Annular Ring – Minimum annular ring of paste mask around a pad or other copper area.
  • Minimum Width – Minimum width for all paste mask areas.
  • Missing Paste Mask on SMD – Any SMD pad without a paste mask area.
  • Missing Solder Mask for Paste Mask – Any paste mask area without a solder mask exposure.
  • Extra Paste Mask (Through) – Any paste mask area on a through drill.
  • Paste Mask to Paste Mask – Minimum distance between adjacent paste mask areas.
  • Global Fiducials – Minimum number of global fiducials.
  • Paste Mask Pad Aspect Ratio – Minimum area of paste mask as a ratio to paste mask thickness.
  • Paste Mask Pad Area Ratio – Minimum width of paste mask as a ratio to paste mask thickness.

 

  • Silkscreen to Solder Mask – Minimum distance between solder mask exposure and adjacent silkscreen features.
  • Minimum Silkscreen Width – Minimum width of a silkscreen feature.
  • Silkscreen to Board Outline – Minimum distance between any silkscreen feature and the board outline.

  • Overlapping Drills – Any pair of drills that touch (have zero clearance between them).
  • Coincidental Drills – Any same sized drills in the same location, but from different tool numbers.
  • Redundant Drills – Any drills in the same location, made by the same tool number.
  • Drill to Drill – Minimum distance between a pair of drills.
  • Imploded Mill Arcs – Any radius in a mill path smaller than the mill tool diameter.
  • Imploded Mill Path – Any mill path that crosses over itself.
  • Mill Tab Errors – Any mill path segment shortened by compensation to the point where the mill tab will no longer fit.
  • Drill Aspect Ratio – A ratio of smallest through drill diameter to board thickness.
  • Through to Backdrill – Minimum distance between adjacent (non via) through and backdrill drills.
  • Through to Unplated – Minimum distance between adjacent (non via) through and unplated drills.
  • Through to Blind – Minimum distance between adjacent (non via) through and blind via drills.
  • Through to Buried – Minimum distance between adjacent (non via) through and buried via drills.
  • Through to Laser – Minimum distance between adjacent (non via) through and laser via drills.
  • Through to Via – Minimum distance between adjacent (non via) through and through via drills.
  • Through to Through – Minimum distance between adjacent (non via) through drills
  • Laser to Backdrill – Minimum distance between adjacent laser via and backdrill drills.
  • Laser to Unplated – Minimum distance between adjacent laser via and unplated drills.
  • Laser to Blind – Minimum distance between adjacent laser via and blind via drills.
  • Laser to Buried – Minimum distance between adjacent laser via and buried via drills.
  • Laser to Laser – Minimum distance between adjacent laser via drills.
  • Buried to Backdrill – Minimum distance between adjacent buried via and backdrill drills.
  • Buried to Unplated – Minimum distance between adjacent buried via and unplated drills.
  • Buried to Blind – Minimum distance between adjacent buried via and blind via drills.
  • Buried to Buried – Minimum distance between adjacent buried via drills.
  • Blind to Backdrill – Minimum distance between adjacent blind via and backdrill drills.
  • Blind to Unplated – Minimum distance between adjacent blind via and unplated drills.
  • Blind to Blind – Minimum distance between adjacent blind via drills.
  • Unplated to Backdrill – Minimum distance between adjacent unplated and backdrill drills.
  • Unplated to Unplated – Minimum distance between adjacent unplated drills.
  • Backdrill to Backdrill – Minimum distance between adjacent backdrill drills.

 

  • Part Outline to Part Outline – Minimum distance between adjacent part outlines.
  • Pad to Pad – Minimum distance between pads of adjacent parts.
  • Part Outline to Pad – Minimum distance between part outlines and adjacent pads.

 

  • Design Compare – Compare design data from variable sources for mismatched layer or drill content.

 

  • Netlist Compare – Compares design data against an externally generated IPC (CAD) netlist and reports differences graphically.

 

  • The Design Analyzer judges the technology level of a particular design. The overall complexity of the design is analyzed for quoting purposes or for qualifying a fabricator.
  • User Parameters – Customer information and Company information can be specified.
  • Calculated parameters – Design analyses are performed to determine the design complexity.
  • Customized output format – Various output formats can be customized by the user.